Patent Assignment
Reel/Frame 034173/0142
Assignment of Assignor's Interest
Recorded: 2014-11-14
Pages: 3
Assignors
IWANO, TOMOHIRO
Executed: 2014-10-09
MINAMI, HISATAKA
Executed: 2014-10-09
AKUTSU, TOSHIAKI
Executed: 2014-10-09
Assignee
HITACHI CHEMICAL COMPANY, LTD.
9-2, MARUNOUCHI 1-CHOME, CHIYODA-KU,, TOKYO, 100-6606, JAPAN
Covered Property
(1)
Slurry, Polishing-Solution Set, Polishing Solution, Substrate Polishing Method, and Substrate
Related Assignments
(4)
Other recorded transfers of the patent in this record — the chain of ownership.
Corrective Assignment to Correct the Original Electronic Cover Sheet and Notice of Recordation. the Fourth Inventor Was Omitted Previously Recorded at Reel: 034173 Frame: 0142. Assignor(S) Hereby Confirms the Assignment.
Dec 4, 2014
From: IWANO, TOMOHIRO; MINAMI, HISATAKA; AKUTSU, TOSHIAKI; FUJISAKI, KOJI
To: HITACHI CHEMICAL COMPANY, LTD.
Reel/Frame 034535/0421 →
Change of Name
Mar 2, 2023
From: HITACHI CHEMICAL COMPANY, LTD.
To: SHOWA DENKO MATERIALS CO., LTD.
Reel/Frame 062917/0865 →
Change of Name
Mar 3, 2023
From: SHOWA DENKO MATERIALS CO., LTD.
To: RESONAC CORPORATION
Reel/Frame 062946/0125 →
Change of Address
Feb 14, 2024
From: RESONAC CORPORATION
To: RESONAC CORPORATION
Reel/Frame 066599/0037 →