Patent Assignment
Reel/Frame 034173/0275
Assignment of Assignor's Interest
Recorded: 2014-11-14
Pages: 7
Assignors
RAO, VALLURI BOB
Executed: 2014-09-02
SARASWAT, RUCHIR
Executed: 2014-09-02
COWLEY, NICHOLAS P.
Executed: 2014-09-06
LEE, KEVIN J.
Executed: 2014-08-27
ZILLMANN, UWE
Executed: 2014-08-28
LUND-LARSEN, TOR
Executed: 2014-09-01
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Die with Integrated Microphone Device Using Through-Silicon Vias (Tsvs)
PCT:
PCT/US2014/056133 ↗
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.