IP Library › Assignment 057767/0328
Patent Assignment
Reel/Frame 057767/0328

Assignment of Assignor's Interest

Recorded: 2021-10-12 Pages: 9
Assignor
INTEL CORPORATION
Executed: 2021-10-04
Assignee
EXO IMAGING, INC.
3600 BRIDGE PARKWAY, SUITE 102, REDWOOD CITY, CALIFORNIA, 94065
Covered Properties (29)
Module Integrating Mems and Passive Components
Multi Die Package Structures
Backside Bulk Silicon Mems
Configurable Ultrasound Measurement Logic in a Mobile Computing Device
Microelectromechanical System (Mems) on Application Specific Integrated Circuit (Asic)
Methods of Forming Buried Microelectricomechanical Structures Coupled with Device Substrates and Structures Formed Thereby
Bendable and Stretchable Electronic Devices and Methods
Die with Integrated Microphone Device Using Through-Silicon Vias (Tsvs)
Stacked Package Assembly with Voltage Reference Plane
Stacked Package Electronic Device
Patent: 7,245,003 →
Application: 10/880,998 →
Publication: US 2006/0003494
Module Integrating Mems and Passive Components
Patent: 7,183,622 →
Application: 10/882,635 →
Publication: US 2006/0001123
Stacked Package Electronic Device
Patent: 7,705,467 →
Application: 11/769,536 →
Publication: US 2007/0278645
Configurable Ultrasound Measurement Logic in a Mobile Computing Device
Patent: 9,116,238 →
Application: 13/171,070 →
Publication: US 2013/0003502
Methods of Forming Buried Electromechanical Structures Coupled with Device Substrates and Structures Formed Thereby
Patent: 9,061,890 →
Application: 13/798,600 →
Publication: US 2014/0264643
Backside Bulk Silicon Mems
Patent: 9,196,752 →
Application: 13/976,086 →
Publication: US 2014/0117470
A Multi Die Package Having a Die and a Spacer Layer in a Recess
Patent: 9,490,196 →
Application: 13/977,183 →
Publication: US 2013/0277865
Through-Silicon via (Tsv)-Based Devices and Associated Techniques and Configurations
Patent: 9,786,581 →
Application: 14/203,415 →
Publication: US 2015/0255372
Microelectromechanical System (Mems) on Application Specific Integrated Circuit (Asic)
Patent: 9,663,353 →
Application: 14/403,571 →
Publication: US 2016/0200566
Bendable and Stretchable Electronic Devices and Methods
Application: 14/653,033 →
Publication: US 2016/0284630
Methods of Forming Buried Electromechanical Structures Coupled with Device Substrates and Structures Formed Thereby
Application: 14/733,926 →
Publication: US 2015/0266725
Backside Bulk Silicon Mems
Patent: 9,850,121 →
Application: 14/949,470 →
Publication: US 2016/0075551
Patch System for in-Situ Therapeutic Treatment
Patent: 9,735,893 →
Application: 15/216,502 →
Semiconductor Package Having Spacer Layer
Application: 15/289,058 →
Publication: US 2017/0025392
Microelectromechanical System (Mems) on Application Specific Integrated Circuit (Asic)
Application: 15/484,765 →
Publication: US 2017/0217766
DIE WITH INTEGRATED MICROPHONE DEVICE USING THROUGH-SILICON VIAS (TSVs)
Application: 15/502,495 →
Publication: US 2017/0245035
Patch System for in-Situ Therapeutic Treatment
Patent: 9,967,040 →
Application: 15/676,611 →
Publication: US 2018/0026730
Stacked Package Assembly with Voltage Reference Plane
Application: 15/766,150 →
Publication: US 2018/0294252
Microelectromechanical System (Mems) on Application Specific Integrated Circuit (Asic)
Application: 15/857,461 →
Publication: US 2018/0186627
Semiconductor Package Having Spacer Layer
Application: 16/127,004 →
Publication: US 2019/0006325
Related Assignments (13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest Jun 1, 2012
From: PRAKASH, GYAN; RAJA, KANNAN G.; DADU, SAURABH
To: INTEL CORPORATION
Reel/Frame 028303/0158 →
Assignment of Assignor's Interest Nov 19, 2012
From: BASKARAN, RAJASHREE; PELTO, CHRISTOPHER M.
To: INTEL CORPORATION
Reel/Frame 029322/0052 →
Assignment of Assignor's Interest Jul 1, 2013
From: OFNER, GERALD; MEYER, THORSTEN; MAHNKOPF, REINHARD; GEISSLER, CHRISTIAN
To: INTEL IP CORPORATION
Reel/Frame 030719/0662 →
Assignment of Assignor's Interest Mar 19, 2014
From: KAMGAING, TELESPHOR
To: INTEL CORPORATION
Reel/Frame 032474/0945 →
Assignment of Assignor's Interest Nov 4, 2014
From: BASKARAN, RAJASHREE
To: INTEL CORPORATION
Reel/Frame 034103/0509 →
Assignment of Assignor's Interest Nov 14, 2014
From: RAO, VALLURI BOB; SARASWAT, RUCHIR; COWLEY, NICHOLAS P.; LEE, KEVIN J.
To: INTEL CORPORATION
Reel/Frame 034173/0275 →
Assignment of Assignor's Interest Jun 12, 2015
From: LEVANDER, ALEJANDRO; ANDRYUSHCHENKO, TATYANA; STAINES, DAVID; KOBRINSKY, MAURO
To: INTEL CORPORATION
Reel/Frame 035902/0042 →
Assignment of Assignor's Interest Sep 18, 2015
From: BASKARAN, RAJASHREE
To: INTEL CORPORATION
Reel/Frame 036605/0137 →
Assignment of Assignor's Interest Nov 5, 2015
From: CHEAH, BOK ENG; KONG, JACKSON CHUNG PENG; OOI, PING PING; OOI, KOOI CHI
To: INTEL CORPORATION
Reel/Frame 037055/0088 →
Assignment of Assignor's Interest Jan 26, 2017
From: ALEKSOV, ALEKSANDAR; OSTER, SASHA N; EID, FERAS; ELSHERBINI, ADEL A
To: INTEL CORPORATION
Reel/Frame 041096/0438 →
Assignment of Assignor's Interest Jun 8, 2021
From: INTEL IP CORPORATION
To: INTEL CORPORATION
Reel/Frame 056524/0373 →
Assignment of Assignor's Interest May 17, 2023
From: LI, DELIN
To: INTEL CORPORATION
Reel/Frame 063678/0034 →
Security Interest Dec 4, 2025
From: EXO IMAGING, INC.
To: WTI FUND X, INC.; WTI FUND XI, INC.
Reel/Frame 073852/0075 →