Patent Assignment
Reel/Frame 032474/0945
Assignment of Assignor's Interest
Recorded: 2014-03-19
Pages: 3
Assignor
KAMGAING, TELESPHOR
Executed: 2014-02-26
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Through-Silicon via (Tsv)-Based Devices and Associated Techniques and Configurations
Related Assignments
(2)
Other recorded transfers of the patent in this record — the chain of ownership.