Through-silicon via (TSV)-based devices and associated techniques and configurations
Embodiments of the present disclosure are directed toward through-silicon via (TSV)-based devices and associated techniques and configurations. In one embodiment, an apparatus includes a die having active circuitry disposed on a first side of the die and a second side disposed opposite to the first side, a bulk semiconductor material disposed between the first side and the second side of the die and a device including one or more of a capacitor, resistor or resonator disposed in the bulk semiconductor material, the capacitor, resistor or resonator including one or more TSV structures that extend through the bulk semiconductor material, an electrically insulative material disposed in the one or more TSV structures and an electrode material or resistor material in contact with the electrically insulative material within the one or more TSV structures.
1. An apparatus comprising:
a die having active circuitry disposed on a first side of the die and a second side disposed opposite to the first side;
a bulk semiconductor material disposed between the first side and the second side of the die; and
a device including a resonator disposed in the bulk semiconductor material, the resonator including:
one or more through-silicon via (TSV) structures that extend through the bulk semiconductor material;
an electrically insulative material disposed in the one or more TSV structures;
an electrode material in contact with the electrically insulative material within the one or more TSV structures, wherein the electrode material is a first electrode; and
a second electrode coupled to an interconnect layer on the bulk semiconductor material.
2. The apparatus of claim 1 , wherein
the electrode material is to provide an electrode for the resonator.
3. The apparatus of claim 2 , wherein:
the second electrode is disposed on surfaces of the one or more TSV structures, wherein the first electrode and the second electrode are coupled through the electrically insulative material.
4. The apparatus of claim 3 , wherein:
the second electrode includes portions disposed on sidewalls of the one or more TSV structures and portions that are disposed in a device layer or interconnect layer of the die.
5. The apparatus of claim 3 , further comprising:
a passivation layer disposed on the first electrode, wherein the first electrode includes one or more portions that extend a distance into the one or more TSV structures that is greater than half of a thickness of the bulk semiconductor material.
6. The apparatus of claim 3 , wherein the first electrode comprises metal and the second electrode comprises silicon or metal.
7. The apparatus of claim 2 , wherein the electrode material includes portions that extend from the second side of the die through the bulk semiconductor material and into a device layer or interconnect layer of the die.
8. The apparatus of claim 1 , wherein the device is a microelectromechanical (MEM) resonator.
9. The apparatus of claim 8 , wherein the MEM resonator is an acceleration sensor.
10. The apparatus of claim 8 , wherein the first electrode and the second electrode are capacitively coupled through the electrically insulative material.
11. The apparatus of claim 10 , wherein the second electrode includes first portions that are disposed on a dielectric liner that is disposed on sidewalls of the one or more TSV structures and second portions that are disposed in a device layer or interconnect layer of the die.
12. The apparatus of claim 11 , wherein the electrically insulative material comprises air or a piezoelectric material, the apparatus further comprising:
a first dielectric liner disposed between the second electrode and the bulk semiconductor material; and
a second dielectric liner disposed between the second electrode and the electrically insulative material.
13. The apparatus of claim 11 , further comprising:
an inductor disposed in an interconnect layer of the die and electrically coupled with the second portions of the second electrode.
14. An apparatus comprising:
a die having active circuitry disposed on a first side of the die and a second side disposed opposite to the first side;
a bulk semiconductor material disposed between the first side and the second side of the die; and
a device including a resistor disposed in the bulk semiconductor material, the resistor including:
one or more through-silicon via (TSV) structures that extend through the bulk semiconductor material;
an electrically insulative material disposed in the one or more TSV structures;
a resistor material in contact with the electrically insulative material within the one or more TSV structures;
one or more interconnect layers disposed on the second side of the die and electrically coupled with the resistor material;
one or more through-silicon vias (TSVs) that extend through the bulk semiconductor material and are to route electrical signals between the first side of the die and the one or more interconnect layers; and
an electrically insulative layer disposed on the one or more interconnect layers and the resistor material.
15. The apparatus of claim 14 , wherein portions of the resistor material are disposed in a device layer or interconnect layer of the die.
16. The apparatus of claim 14 , wherein the resistor material comprises a carbon-based material or ceramic-based material.
17. The apparatus of claim 16 , wherein the resistor material comprises tantalum nitride, lead oxide, ruthenium oxide, nickel chromium or bismuth iridate.
18. A method comprising:
providing a die having
a first side and a second side disposed opposite to the first side, and
a bulk semiconductor material disposed between the first side and the second side;
forming active circuitry on the first side of the die; and
forming a device including a resonator by:
forming one or more through-silicon via (TSV) structures that extend through the bulk semiconductor material;
providing an electrically insulative material in the one or more TSV structures;
providing first electrode material in direct contact with the electrically insulative material within the one or more TSV structures; and
providing a second electrode coupled to an interconnect layer on the bulk semiconductor material.
19. The method of claim 18 , wherein providing the second electrode further comprises:
forming one or more land structures in a device layer or interconnect layer of the die, wherein removing the portions of the bulk semiconductor material to form one or more corresponding openings through the bulk semiconductor material exposes the one or more land structures.
20. The method of claim 18 , wherein:
forming the device comprises forming a resonator;
providing the electrically insulative material comprises forming an air gap or depositing a piezoelectric material;
providing the first electrode material comprises depositing the first electrode material to form a first electrode;
forming the one or more TSV structures comprises removing portions of the bulk semiconductor material to form one or more corresponding openings through the bulk semiconductor material;
forming the resonator further comprises forming a dielectric liner on sidewall surfaces of the one or more TSV structures that are exposed by removing portions of the bulk semiconductor material; and
forming the resonator further comprises forming the second electrode on the dielectric liner, wherein the first electrode and the second electrode are capacitively coupled through the electrically insulative material.