IP Library Granted Patent US 7,705,467
Granted Patent B2
US 7,705,467 · App. 11/769,536 · Granted Apr 27, 2010

Stacked package electronic device

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Quick Facts
Patent No.
US 7,705,467
App. No.
11/769,536
Granted
Apr 27, 2010
Kind
B2
Abstract

An electrical component includes a substrate, a first integrated circuit attached to the substrate, a metal portion coupled to the first integrated circuit, and a second integrated circuit attached to the first integrated circuit. The metal portion is sandwiched between the first integrated circuit and the second integrated circuit.

Claims (25)

1. An electrical system comprising:

a printed circuit board; and

at least one electrical component attached to the printed circuit board, the at least one component including:

a substrate;

a first integrated circuit attached to the substrate;

a metal portion coupled to the first integrated circuit; and

a second integrated circuit coupled to the first integrated circuit, wherein the metal portion of the at least one electrical component is sandwiched between the first integrated circuit and the second integrated circuit;

a ground; and

a coupling between the ground and the metal portion, wherein the second integrated circuit includes a signal input/output, the electrical component further comprising a connection between the signal input/output on the second integrated circuit and a pad on the substrate.

2. The electrical system of claim 1 wherein the metal portion of the at least one electrical component is stacked between the first integrated circuit and the second integrated circuit.

3. The electrical system of claim 1 wherein the metal portion includes at least one opening sufficiently small to substantially inhibit electromagnetic transmissions between the first integrated circuit and the second integrated circuit.

4. An electrical system comprising:

a printed circuit board; and

at least one electrical component attached to the printed circuit board, the at least one component including:

a substrate;

a first integrated circuit attached to the substrate;

a metal portion coupled to the first integrated circuit; and

a second integrated circuit coupled to the first integrated circuit, wherein the metal portion of the at least one electrical component is sandwiched between the first integrated circuit and the second integrated circuit, wherein the metal portion is foil.

5. An electrical system comprising:

a printed circuit board; and

at least one electrical component attached to the printed circuit board, the at least one component including:

a substrate;

a first integrated circuit attached to the substrate;

a metal portion coupled to the first integrated circuit; and

a second integrated circuit coupled to the first integrated circuit, wherein the metal portion of the at least one electrical component is sandwiched between the first integrated circuit and the second integrated circuit, wherein the metal portion is a plate.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2023
From: LI, DELIN
To: INTEL CORPORATION
Reel/Frame 063678/0034 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 12, 2021
From: INTEL CORPORATION
To: EXO IMAGING, INC.
Reel/Frame 057767/0328 →