IP Library Granted Patent US 10,204,855
Granted Patent B2
US 10,204,855 · App. 14/653,033 · Granted Feb 12, 2019

Bendable and stretchable electronic devices and methods

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,204,855
App. No.
14/653,033
Granted
Feb 12, 2019
Kind
B2
Abstract

Generally discussed herein are systems and methods that can include a stretchable and bendable device. According to an example a method can include (1) depositing a first elastomer material on a panel, (2) laminating trace material on the elastomer material, (3) processing the trace material to pattern the trace material into one or more traces and one or more bond pads, (4) attaching a die to the one or more bond pads, or (5) depositing a second elastomer material on and around the one or more traces, the bonds pads, and the die to encapsulate the one or more traces and the one or more bond pads in the first and second elastomer materials.

Claims (11)

1. An apparatus comprising:

an elastomer substrate;

a plurality of meandering traces encapsulated in the elastomer substrate;

a plurality of bond pads encapsulated in the elastomer substrate, wherein bond pads of the plurality of bond pads are electrically coupled through a meandering trace of the plurality of meandering traces;

a material, different from the elastomer substrate, with an elastic modulus between an elastic modulus of the elastomer substrate and the elastic modulus of the meandering traces, between the meandering traces and the elastomer substrate, in direct physical contact with the meandering traces on vertical sides and top and bottom sides of the meandering traces, in direct physical contact with the elastomer substrate, forming an interface between the meandering traces and the elastomer substrate, and encapsulated by the elastomer substrate;

a bendable electronic die with a thickness of between about ten and three hundred microns encapsulated in the elastomer substrate; and

electrical bonds coupling the die to the bond pads.

2. The apparatus of claim 1 , wherein the traces are less than 500 nanometers thick.

3. The apparatus of claim 1 , wherein the elastomer includes PolyDiMethySiloxane (PDMS) and the traces include copper.

4. The apparatus of claim 3 , wherein the material includes polyimide.

5. The apparatus of claim 3 , wherein the material includes at least one of polyethylterephthalate, polyethelene naphtalate, and polyolephine.

Assignments (2)
SECURITY INTEREST Recorded Dec 4, 2025
From: EXO IMAGING, INC.
To: WTI FUND X, INC.; WTI FUND XI, INC.
Reel/Frame 073852/0075 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 12, 2021
From: INTEL CORPORATION
To: EXO IMAGING, INC.
Reel/Frame 057767/0328 →