Patent Assignment
Reel/Frame 034174/0844
Assignment of Assignor's Interest
Recorded: 2014-11-14
Pages: 4
Assignors
LEE, DONG HWAN
Executed: 2014-10-20
YOON, CHAN
Executed: 2014-10-20
CHA, HYE YEON
Executed: 2014-10-20
HAN, JIN WOO
Executed: 2014-10-20
Assignee
SAMSUNG ELECTRO-MECHANICS CO., LTD.
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Chip Electronic Component and Board for Mounting Thereof