Patent Assignment
Reel/Frame 034179/0723
Assignment of Assignor's Interest
Recorded: 2014-11-06
Pages: 10
Assignors
SEO, JANGMEE
Executed: 2014-08-23
LEE, HEESEOK
Executed: 2014-09-01
LEE, JONG-WON
Executed: 2014-09-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO, SUWON-SI, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package and Method of Fabricating the Same