Patent Assignment
Reel/Frame 034191/0085
Assignment of Assignor's Interest
Recorded: 2014-11-17
Pages: 6
Assignors
CHOI, JU-IL
Executed: 2014-11-05
PARK, KUN-SANG
Executed: 2014-11-05
HWANG, SON-KWAN
Executed: 2014-11-05
PARK, JI-SOON
Executed: 2014-11-05
PARK, BYUNG-LYUL
Executed: 2014-11-05
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Integrated Circuit Device Including Through-Silicon via Structure and Method of Manufacturing the Same