Patent Assignment
Reel/Frame 034197/0844
Assignment of Assignor's Interest
Recorded: 2014-11-18
Pages: 3
Assignors
FANG, JIA-WEI
Executed: 2014-11-18
SHIH, CHI-JIH
Executed: 2014-11-18
HUANG, SHEN-YU
Executed: 2014-11-18
Assignee
MEDIATEK INC.
NO. 1, DUSING RD. 1ST, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300, TAIWAN
Covered Property
(1)
Method for Co-Designing Flip-Chip and Interposer