Patent Assignment
Reel/Frame 034205/0491
Assignment of Assignor's Interest
Recorded: 2014-11-19
Pages: 3
Assignors
RYU, SUNG WUK
Executed: 2014-11-12
KIM, DONG SUN
Executed: 2014-11-12
SHIN, SEUNG YUL
Executed: 2014-11-12
Assignee
LG INNOTEK CO., LTD.
SEOUL SQUARE, 541, NAMDAEMUNNO 5-GA, JUNG-GU, SEOUL, 100-714, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Substrate, Package System Using the Same and Method for Manufacturing Thereof