Patent Assignment
Reel/Frame 034229/0662
Assignment of Assignor's Interest
Recorded: 2014-11-21
Pages: 2
Assignors
WANG, TZU-YU
Executed: 2010-02-03
CHIU, TZU-WEI
Executed: 2010-02-03
JENG, SHIN-PUU
Executed: 2010-02-04
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. VI, HSINCHU SCIENCE PARK, HSINCHU, 300, TAIWAN
Covered Property
(1)
Stress Buffer Structures in a Mounting Structure of a Semiconductor Device