IP Library Assignment 034269/0205
Patent Assignment
Reel/Frame 034269/0205

Assignment of Assignor's Interest

Recorded: 2014-11-26 Pages: 9
Assignors
THOMAS, TESSIL
Executed: 2014-11-26
KANDULA, PHANI KUMAR
Executed: 2014-11-20
KRITHIVAS, RAMAMURTHY
Executed: 2014-11-24
CHIN, HOWARD
Executed: 2014-11-25
STEINER, IAN M.
Executed: 2014-11-24
GARG, VIVEK
Executed: 2014-11-24
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Apparatus and Method for Thermal Management in a Multi-Chip Package
Application: 14/554,384 →
Publication: US 2016/0147291
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 18, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072890/0413 →