Patent Assignment
Reel/Frame 072890/0413
Assignment of Assignor's Interest
Recorded: 2025-09-18
Pages: 70
Assignor
INTEL CORPORATION
Executed: 2025-08-19
Assignee
SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
10951 WHITE ROCK ROAD, RANCHO CORDOVA, CALIFORNIA, 95670
Covered Properties
(20)
Apparatus and Method for Thermal Management in a Multi-Chip Package
Resistive Memory Write Circuitry with Bit Line Drive Strength Based on Storage Cell Line Resistance
Patent:
9,281,043 →
Application:
14/582,745 →
Computing Method and Apparatus Associated with Context-Aware Management of a File Cache
Method, Apparatus and System for Optimizing Cache Memory Transaction Handling in a Processor
Enhanced Security of Power Management Communications and Protection from Side Channel Attacks
Magnetic Storage Cell Memory with Back Hop-Prevention
Efficient Redundant Array of Independent Disks (Raid) Write Hole Solutions
Technologies for a Distributed Hardware Queue Manager
On-Die System Electrostatic Discharge Protection
Signal Phase Optimization in Memory Interface Training
Offload Data Transfer Engine for a Block Data Transfer Interface
Magnetic Storage Cell Memory with Back Hop-Prevention
Substrates, Assembles, and Techniques to Enable Multi-Chip Flip Chip Packages
Pre-Molded Active Ic of Passive Components to Miniaturize System in Package
Flip-Chip Like Integrated Passive Prepackage for Sip Device
Techniques for Securing and Controlling Access to Data
Technologies for Error Handling for High Speed I/O Data Transfer
Techniques for Securing and Controlling Access to Data
Microelectronic Package Having Electromagnetic Interference Shielding
Slim External Wireless Storage Drive
Patent:
796,502 →
Application:
29/505,654 →
Related Assignments
(13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Nov 26, 2014
From: THOMAS, TESSIL; KANDULA, PHANI KUMAR; KRITHIVAS, RAMAMURTHY; CHIN, HOWARD
To: INTEL CORPORATION
Reel/Frame 034269/0205 →
Assignment of Assignor's Interest
Mar 12, 2015
From: WANG, REN; ZHAO, WEISHUANG; SHEN, WEI; MESNIER, MICHAEL P.
To: INTEL CORPORATION
Reel/Frame 035155/0446 →
Assignment of Assignor's Interest
Apr 17, 2015
From: FAHIM, BAHAA; LIU, YEN-CHENG; GEETHA, VEDARAMAN; CHAMBERLAIN, JEFFREY D.
To: INTEL CORPORATION
Reel/Frame 035453/0468 →
Assignment of Assignor's Interest
Jun 16, 2015
From: POORNACHANDRAN, RAJESH; SMITH, NED M.
To: INTEL CORPORATION
Reel/Frame 035845/0501 →
Assignment of Assignor's Interest
Oct 7, 2015
From: JAIN, PULKIT; HAMZAOGLU, FAITH; WEI, LIQIONG
To: INTEL CORPORATION
Reel/Frame 036746/0009 →
Assignment of Assignor's Interest
Nov 4, 2015
From: FREYENSEE, JAMES P; TRIKA, SANJEEV N.; VEAL, BRYAN E.
To: INTEL CORPORATION
Reel/Frame 036958/0306 →
Assignment of Assignor's Interest
Jan 13, 2016
From: AUGUSTINE, CHARLES; TOMISHIMA, SHIGEKI; WU, WEI; LU, SHIH-LIEN
To: INTEL CORPORATION
Reel/Frame 037479/0155 →
Assignment of Assignor's Interest
Nov 18, 2016
From: MORRIS, TONIA G.; ZHOU, YING; LOVELACE, JOHN V.; PEREZ GUEVARA, ALBERTO DAVID
To: INTEL CORPORATION
Reel/Frame 040373/0196 →
Assignment of Assignor's Interest
Apr 24, 2017
From: RAJ, ASHOK; RADHAKRISHNAN, SIVAKUMAR; WILLIAMS, DAN J.; VERMA, VISHAL
To: INTEL CORPORATION
Reel/Frame 042131/0137 →
Assignment of Assignor's Interest
May 2, 2017
From: THOMPSON, GABRIEL J; ZIA, VICTOR; MOZAK, CHRISTOPHER P
To: INTEL CORPORATION
Reel/Frame 042205/0034 →
Assignment of Assignor's Interest
Aug 30, 2017
From: WANG, REN; WANG, YIPENG; TSAI, JR-SHIAN; HERDRICH, ANDREW
To: INTEL CORPORATION
Reel/Frame 043723/0678 →
Assignment of Assignor's Interest
Sep 14, 2020
From: GUO, MAO; MEYERS, JOHN G.; SHE, YONG; LIN, BIN
To: INTEL CORPORATION
Reel/Frame 053766/0190 →
Assignment of Assignor's Interest
May 17, 2021
From: DING, ZHICHENG; LIN, BIN
To: INTEL CORPORATION
Reel/Frame 056265/0534 →