IP Library Assignment 053766/0190
Patent Assignment
Reel/Frame 053766/0190

Assignment of Assignor's Interest

Recorded: 2020-09-14 Pages: 4
Assignors
GUO, MAO
Executed: 2015-12-09
MEYERS, JOHN G.
Executed: 2015-12-09
SHE, YONG
Executed: 2019-12-09
LIN, BIN
Executed: 2015-12-09
TAN, LINGYAN L.
Executed: 2015-12-09
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Pre-Molded Active Ic of Passive Components to Miniaturize System in Package
Application: 15/772,483 →
Publication: US 2018/0331004
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 18, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072890/0413 →