IP Library Assignment 056265/0534
Patent Assignment
Reel/Frame 056265/0534

Assignment of Assignor's Interest

Recorded: 2021-05-17 Pages: 3
Assignors
DING, ZHICHENG
Executed: 2015-12-08
LIN, BIN
Executed: 2015-12-08
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property (1)
Flip-Chip Like Integrated Passive Prepackage for Sip Device
Application: 15/777,810 →
Publication: US 2018/0374835
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Sep 18, 2025
From: INTEL CORPORATION
To: SK HYNIX NAND PRODUCT SOLUTIONS CORP. (DBA SOLIDIGM)
Reel/Frame 072890/0413 →