Patent Assignment
Reel/Frame 034272/0465
Assignment of Assignor's Interest
Recorded: 2014-11-26
Pages: 2
Assignors
CHING, KUO-CHENG
Executed: 2014-11-20
FUNG, KA-HING
Executed: 2014-11-20
WU, ZHIQIANG
Executed: 2014-11-20
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
NO. 8, LI-HSIN RD. 6 SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
High Mobility Devices with Anti-Punch Through Layers and Methods of Forming Same