Patent Assignment
Reel/Frame 034273/0043
Assignment of Assignor's Interest
Recorded: 2014-11-26
Pages: 3
Assignee
TDK CORPORATION
13-9-1 SHIBAURA, MINATO-KU, TOKYO, 108-0023, JAPAN
Covered Property
(1)
Ic Embedded Substrate and Method of Manufacturing the Same