Patent Assignment
Reel/Frame 034290/0491
Assignment of Assignor's Interest
Recorded: 2014-12-01
Pages: 3
Assignor
LIAW, JHON JHY
Executed: 2014-10-08
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., ("TSMC")
NO. 8, LI-HSIN RD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Multi-Stage Fin Formation Methods and Structures Thereof