Patent Assignment
Reel/Frame 034290/0663
Assignment of Assignor's Interest
Recorded: 2014-12-01
Pages: 3
Assignors
LIANG, CHIA-YAO
Executed: 2014-09-30
LIAO, CHEN-LIANG
Executed: 2014-09-30
LEI, MING
Executed: 2014-09-30
CHEN, CHIH-HSIAO
Executed: 2014-09-30
HUANG, YI-LII
Executed: 2014-10-09
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO.8, LI-HSIN ROAD. 6, SCIENCE-BASED INDUSTRIAL PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
Semiconductor Device Structure and Method for Forming the Same