Patent Assignment
Reel/Frame 034313/0748
Assignment of Assignor's Interest
Recorded: 2014-12-02
Pages: 7
Assignors
JUN, YONG-MYUNG
Executed: 2014-11-26
KO, YONG-SUN
Executed: 2014-11-26
LEE, KUN-TACK
Executed: 2014-11-26
LEE, IL-SANG
Executed: 2014-11-26
JEONG, JI-HOON
Executed: 2014-11-26
CHO, YONG-JHIN
Executed: 2014-11-26
HONG, JIN-SUK
Executed: 2014-11-26
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129 SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Sealing Member and Substrate Processing Apparatus Including the Same