Patent Assignment
Reel/Frame 034315/0010
Assignment of Assignor's Interest
Recorded: 2014-12-03
Pages: 3
Assignee
BRIDGE SEMICONDUCTOR CORPORATION
3FL., 157 LI-TE ROAD, PEITOU DIST., TAIPEI, 11259, TAIWAN
Covered Property
(1)
Semiconductor Package with Package-on-Package Stacking Capability and Method of Manufacturing the Same