Patent Assignment
Reel/Frame 034381/0828
Assignment of Assignor's Interest
Recorded: 2014-12-04
Pages: 3
Assignor
WANG, CHUEN KHIANG
Executed: 2014-12-02
Assignee
UNITED TEST AND ASSEMBLY CENTER LTD.
22 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569506, SINGAPORE
Covered Property
(1)
Semiconductor Packages and Methods of Packaging Semiconductor Devices
Related Assignments
(3)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest
Mar 1, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 037959/0822 →
Corrective Assignment to Correct the to Add the Annex a and the Annex B Which Was Inadvertently Leftout in the Original Assignment Document Previously Recorded on Reel 037959 Frame 0822. Assignor(S) Hereby Confirms the Assignment.
Jul 8, 2016
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 039885/0541 →
Corrective Assignment to Correct the Include Patent Number 8816482 Previously Recorded at Reel: 039885 Frame: 0541. Assignor(S) Hereby Confirms the Assignment.
Sep 25, 2017
From: UNITED TEST AND ASSEMBLY CENTER LIMITED
To: UTAC HEADQUARTERS PTE. LTD.
Reel/Frame 043979/0820 →