Patent Assignment
Reel/Frame 034391/0954
Assignment of Assignor's Interest
Recorded: 2014-12-05
Pages: 7
Assignors
PARK, BYUNG-JUN
Executed: 2014-10-01
MOON, CHANG-ROK
Executed: 2014-10-01
SHIN, SEUNG-HUN
Executed: 2014-10-01
OH, SEONG-HO
Executed: 2014-10-01
OH, TAE-SEOK
Executed: 2014-10-01
LEE, JUNE-TAEG
Executed: 2014-10-01
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF
Covered Property
(1)
Via Structures Including Etch-Delay Structures and Semiconductor Devices Having via Plugs