Patent Assignment
Reel/Frame 034399/0816
Assignment of Assignor's Interest
Recorded: 2014-12-05
Pages: 5
Assignors
HSU, WEN TSUNG
Executed: 2014-11-26
YU, CHENG-HSIEN
Executed: 2014-11-26
TSAI, CHUN YUAN
Executed: 2014-11-26
TSAI, TZUNG SHIOU
Executed: 2014-11-26
YE, JIA HAO
Executed: 2014-11-26
HOU, KUANG YI
Executed: 2014-11-26
Assignee
ADVANCED SEMICONDUCTOR ENGINEERING, INC.
26 CHIN 3RD ROAD, NANTZE EXPORT PROCESSING ZONE, KAOHSIUNG, TAIWAN
Covered Property
(1)
Semiconductor Package Having Improved Package-on-Package Interconnection