Patent Assignment
Reel/Frame 034410/0900
Assignment of Assignor's Interest
Recorded: 2014-12-05
Pages: 4
Assignor
KIM, YONG-HOON
Executed: 2014-10-22
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package with Sidewall Contacting Bonding Tape