Patent Assignment
Reel/Frame 034436/0878
Assignment of Assignor's Interest
Recorded: 2014-12-09
Pages: 5
Assignors
UTSUMI, JUN
Executed: 2013-08-30
GOTO, TAKAYUKI
Executed: 2013-08-30
IDE, KENSUKE
Executed: 2013-08-30
TAKAGI, HIDEKI
Executed: 2013-08-30
FUNAYAMA, MASAHIRO
Executed: 2013-08-30
Assignees
MITSUBISHI HEAVY INDUSTRIES, LTD.
16-5, KONAN 2-CHOME, MINATO-KU, TOKYO, 108-8215, JAPAN
NATIONAL INSTITUTE OF ADVANCED INDUSTRIAL SCIENCE AND TECHNOLOGY
3-1, KASUMIGASEKI 1-CHOME, CHIYODA-KU, TOKYO, JAPAN
Covered Property
(1)
Manufcaturing Method for Room-Temperature Substrate Bonding
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.