Patent Assignment
Reel/Frame 034477/0624
Assignment of Assignor's Interest
Recorded: 2014-12-11
Pages: 4
Assignor
MIZOMOTO, YASUTAKA
Executed: 2014-11-12
Assignee
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,, TOKYO, 143-8580, JAPAN
Covered Property
(1)
Device Wafer Processing Method