Assignment of Assignor's Interest

Recorded: 2014-12-12 Pages: 4

Assignors

NAGATOMO, YOSHIYUKI

Executed: 2012-03-26

KUROMITSU, YOSHIROU

Executed: 2012-03-27

Assignee

MITSUBISHI MATERIALS CORPORATION

3-2, OTEMACHI 1-CHOME, CHIYODA-KU, TOKYO, 100-8117, JAPAN

Covered Property (1)

Method for Producing Substrate for Power Module with Heat Sink, Substrate for Power Module with Heat Sink, and Power Module

Patent: 9,076,755 →

Application: 13/394,923 →

Publication: US 2013/0010429