Patent Assignment
Reel/Frame 034521/0146
Assignment of Assignor's Interest
Recorded: 2014-12-16
Pages: 10
Assignors
TEH, WENG HONG
Executed: 2012-10-25
KULKARNI, DEEPAK
Executed: 2012-10-25
CHIU, CHIA-PIN
Executed: 2012-10-30
HARIRCHIAN, TANNAZ
Executed: 2012-10-25
GUZEK, JOHN S
Executed: 2012-10-26
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Bumpless Build-Up Layer Package Including an Integrated Heat Spreader