Bumpless build-up layer package including an integrated heat spreader
An example includes a die package including a microelectronic die having a lower die surface, an upper die surface parallel to the lower die surface, and a die side, the microelectronic die including an active region and an inactive region. The example optionally includes a heat spreader having a lower heat spreader surface, an upper heat spreader surface parallel to the lower heat spreader surface, and at least one heat spreader side, the heat spreader disposed on the upper surface of the microelectronic die in thermal communication with the inactive region of the die and electrically insulated from the active region. The example optionally includes an encapsulation material encapsulating the die side and the heat spreader side and lower heat spreader surface, the encapsulation material including a lower surface substantially parallel to the die lower surface and an upper surface substantially parallel to the die upper surface.
1. A method of forming a microelectronic die package, comprising:
stacking a lower die surface of a microelectronic die onto a heat spreader in thermal communication with the heat spreader;
forming a cavity through the heat spreader, wherein the cavity forms a direct interface with a portion of the lower die surface of the microelectronic die;
forming an encapsulation material around the microelectronic die and the heat spreader;
building up a plurality of build-up layers onto an upper die surface of the microelectronic die, opposite the lower die surface; and
forming a plurality of conductive traces disposed on the build-up layers in electrical communication with an active region of the microelectronic die.
2. The method of claim 1 , comprising disposing a thermal interface material between the lower die surface and the heat spreader.
3. The method of claim 2 , further comprising stacking a second die on a side of the heat spreader opposite the microelectronic die, including electrically coupling the second die to the microelectronic die through the cavity.
4. The method of claim 1 , wherein stacking a lower die surface of a microelectronic die onto a heat spreader includes utilizing a die bonding film between the lower die surface and the heat spreader.
5. The method of claim 1 , comprising disposing thermal interface material in the cavity.
6. The method of claim 1 , further comprising forming one or more thermal release vias along a side of the microelectronic die, and thermally coupled between an upper surface of the microelectronic die and the heat spreader.
7. The method of claim 6 , further comprising thermally coupling a top side of two stacked dice to the thermal release vias.
8. The method of claim 1 , wherein multiple die packages are formed on opposite sides of a sacrificial carrier.