IP Library Assignment 034521/0808
Patent Assignment
Reel/Frame 034521/0808

Assignment of Assignor's Interest

Recorded: 2014-12-16 Pages: 2
Assignors
BERGMAN, MARK
Executed: 2014-12-16
VRTIS, JOAN K.
Executed: 2014-12-16
GLICKMAM, MICHAEL JAMES
Executed: 2014-12-16
Assignee
MULTEK TECHNOLOGIES, LTD.
6201 AMERICA CENTER DR., SAN JOSE, CALIFORNIA, 95002
Covered Property (1)
Nano-Copper via Fill for Enhanced Thermal Conductivity of Plated Through-Hole Via
Patent: 9,736,947 →
Application: 14/572,636 →
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name May 12, 2023
From: VIASYSTEMS TECHNOLOGIES CORP., L.L.C.
To: TTM TECHNOLOGIES NORTH AMERICA, INC.
Reel/Frame 063635/0226 →