IP Library › Assignment 034522/0544
Patent Assignment
Reel/Frame 034522/0544

Assignment of Assignor's Interest

Recorded: 2014-12-17 Pages: 3
Assignors
TSAI, CHENG-HUA
Executed: 2014-12-09
LAI, SHINN-JUH
Executed: 2014-12-09
CHEN, CHANG-SHENG
Executed: 2014-12-09
CHANG, LI-CHI
Executed: 2014-12-09
LEE, CHING-KUAN
Executed: 2014-12-09
Assignee
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
NO. 195, SEC. 4, CHUNG HSING RD., CHUTUNG,, HSINCHU, 31040, TAIWAN
Covered Property (1)
Integrated Millimeter-Wave Chip Package
Patent: 9,941,226 →
Application: 14/569,791 →
Publication: US 2016/0172317
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Mar 8, 2016
From: CHUNG, SHYH-JONG
To: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
Reel/Frame 038040/0858 →