Patent Assignment
Reel/Frame 034534/0378
Assignment of Assignor's Interest
Recorded: 2014-12-17
Pages: 6
Assignors
KIM, KWANG SOO
Executed: 2014-08-29
UM, KEE JU
Executed: 2014-08-29
LEE, SUK HO
Executed: 2014-08-29
CHAE, JOON SEOK
Executed: 2014-08-29
Assignee
SAMSUNG ELECTRO-MECHANICS
MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU,SUWON-SI, GYEONGGI-DO, 443-743, KOREA, REPUBLIC OF
Covered Property
(1)
Leadless Package Type Power Semiconductor Module