Patent Assignment
Reel/Frame 034545/0314
Assignment of Assignor's Interest
Recorded: 2014-12-18
Pages: 3
Assignee
IBIDEN CO., LTD.
1, KANDACHO 2-CHOME, OGAKI-SHI, GIFU, 503-8604, JAPAN
Covered Property
(1)
Combined Wiring Board and Method for Manufacturing the Same