Patent Assignment
Reel/Frame 034554/0549
Assignment of Assignor's Interest
Recorded: 2014-12-19
Pages: 7
Assignors
KIM, SEOK-HOON
Executed: 2014-12-12
KIM, JIN-BUM
Executed: 2014-12-12
LEE, KWAN-HEUM
Executed: 2014-12-12
LEE, BYEONG-CHAN
Executed: 2014-12-12
LEE, CHO-EUN
Executed: 2014-12-12
HAN, JIN-HEE
Executed: 2014-12-12
KOO, BON-YOUNG
Executed: 2014-12-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Devices Having Bridge Layer and Methods of Manufacturing the Same