Patent Assignment
Reel/Frame 034555/0463
Assignment of Assignor's Interest
Recorded: 2014-12-19
Pages: 3
Assignors
LEE, SEH KWANG
Executed: 2014-11-26
KIM, YOUN CHUL
Executed: 2014-11-26
LEE, JOO HAN
Executed: 2014-11-26
CHOI, JAE KWANG
Executed: 2014-12-01
BOO, JAE PHIL
Executed: 2014-12-02
Assignees
EHWA DIAMOND INDUSTRIAL CO., LTD.
374, NAMBUDAE-RO,, OSAN-SI, GYEONGGI-DO, 447-804, KOREA, REPUBLIC OF
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU,, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Cmp Apparatus