Patent Assignment
Reel/Frame 034570/0147
Assignment of Assignor's Interest
Recorded: 2014-12-22
Pages: 4
Assignor
ZHAO, JUNFENG
Executed: 2014-12-19
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BLVD., SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Method for Interconnecting Stacked Semiconductor Devices