Patent Assignment
Reel/Frame 034574/0503
Assignment of Assignor's Interest
Recorded: 2014-12-23
Pages: 9
Assignors
CHUANG, HARRY-HAK-LAY
Executed: 2014-12-11
WU, WEI CHENG
Executed: 2014-12-11
KAO, YA-CHEN
Executed: 2014-12-11
LIU, SHIH-CHANG
Executed: 2014-12-16
CHU, FANG-LAN
Executed: 2014-12-16
Assignee
TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
NO. 8, LI-HSIN RD. 6, HSIN-CHU SCIENCE PARK, HSIN-CHU, 300-77, TAIWAN
Covered Property
(1)
BOUNDARY SCHEME FOR EMBEDDED POLY-SiON CMOS OR NVM IN HKMG CMOS TECHNOLOGY