Patent Assignment
Reel/Frame 034580/0942
Assignment of Assignor's Interest
Recorded: 2014-12-23
Pages: 3
Assignor
PRACK, EDWARD R.
Executed: 2014-12-23
Assignee
INTEL CORPORATION
2200 MISSION COLLEGE BOULEVARD, SANTA CLARA, CALIFORNIA, 95054
Covered Property
(1)
Formation of Solder and Copper Interconnect Structures and Associated Techniques and Configurations