IP Library › Assignment 034603/0557
Patent Assignment
Reel/Frame 034603/0557

Assignment of Assignor's Interest

Recorded: 2014-12-30 Pages: 6
Assignors
LIU, WENHU
Executed: 2014-11-24
JUNG, SUNG MUN
Executed: 2014-12-11
LIM, YI TAT
Executed: 2014-12-11
WU, LING
Executed: 2014-12-13
Assignee
GLOBALFOUNDRIES SINGAPORE PTE. LTD.
60 WOODLANDS INDUSTRIAL PARK D STREET 2, SINGAPORE, 738406, SINGAPORE
Covered Property (1)
Integrated Circuits, Methods of Forming the Same, and Methods of Determining Gate Dielectric Layer Electrical Thickness in Integrated Circuits
Patent: 9,911,665 →
Application: 14/586,466 →
Publication: US 2016/0190021
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Security Agreement Nov 27, 2018
From: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
To: WILMINGTON TRUST, NATIONAL ASSOCIATION
Reel/Frame 047660/0203 →
Release of Security Interest Nov 19, 2020
From: WILMINGTON TRUST, NATIONAL ASSOCIATION
To: GLOBALFOUNDRIES SINGAPORE PTE. LTD.
Reel/Frame 054481/0673 →