IP Library › Assignment 034604/0701
Patent Assignment
Reel/Frame 034604/0701

Assignment of Assignor's Interest

Recorded: 2014-12-31 Pages: 4
Assignors
SHU, QINGMING
Executed: 2014-11-14
HU, HONG
Executed: 2014-11-14
ZHANG, SAI
Executed: 2014-11-14
ZHANG, JIANJUN
Executed: 2014-11-14
LIU, JIANG
Executed: 2014-11-14
PAN, RONGHUA
Executed: 2014-11-14
Assignee
GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
SUITE 01-15, A12, TIANGONG BUILDING, XUEYUAN ROAD NO. 30, HAIDIAN DISTRICT, BEIJING, 100083, CHINA
Covered Property (1)
Spi Interface Enhanced Flash Chip and Chip Packaging Method
Patent: 9,836,236 →
Application: 14/412,205 →
Publication: US 2015/0186067
Related Assignments (1)
Other recorded transfers of the patent in this record — the chain of ownership.
Change of Name & Address Oct 13, 2022
From: GIGADEVICE SEMICONDUCTOR (BEIJING) INC.
To: GIGADEVICE SEMICONDUCTOR INC.
Reel/Frame 061668/0819 →