IP Library › Assignment 034605/0939
Patent Assignment
Reel/Frame 034605/0939

Assignment of Assignor's Interest

Recorded: 2014-12-31 Pages: 5
Assignors
KIM, JO HAN
Executed: 2014-12-23
PARK, HEE JIN
Executed: 2014-12-23
KIM, KYEONG SU
Executed: 2014-12-23
LEE, JAE JIN
Executed: 2014-12-23
Assignee
MAGNACHIP SEMICONDUCTOR, LTD.
215, DAESIN-RO, HEUNGDEOK-GU, CHUNGCHEONGBUK-DO, 361-725, CHEONGJU-SI, 361-725, KOREA, REPUBLIC OF
Covered Property (1)
Heat Releasing Semiconductor Chip Package and Method for Manufacturing the Same
Application: 14/587,205 →
Publication: US 2015/0371924
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Nunc Pro Tunc Assignment Mar 14, 2024
From: MAGNACHIP SEMICONDUCTOR, LTD.
To: MAGNACHIP MIXED-SIGNAL, LTD.
Reel/Frame 066878/0875 →
Assignment of Assignor's Interest Jul 7, 2025
From: MAGNACHIP MIXED-SIGNAL, LTD.
To: MAGNACHIP SEMICONDUCTOR, LTD.
Reel/Frame 071813/0800 →