Patent Assignment
Reel/Frame 034609/0436
Assignment of Assignor's Interest
Recorded: 2014-12-31
Pages: 6
Assignors
PARK, CHUL
Executed: 2014-12-12
KIM, KILSOO
Executed: 2014-12-12
LEE, IN
Executed: 2014-12-12
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Semiconductor Package Including Stepwise Stacked Chips