Patent Assignment
Reel/Frame 034613/0883
Assignment of Assignor's Interest
Recorded: 2015-01-02
Pages: 10
Assignors
SHIN, DONG JAE
Executed: 2013-12-23
PARK, YOON DONG
Executed: 2014-08-26
CHOI, SANG HUN
Executed: 2013-12-27
HA, KYOUNG HO
Executed: 2013-12-23
Assignee
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, SUWON-SI, GYEONGGI-DO, 443-742, KOREA, REPUBLIC OF
Covered Property
(1)
Test System and Method for Wafer Including Optical Component