IP Library › Assignment 034632/0594
Patent Assignment
Reel/Frame 034632/0594

Assignment of Assignor's Interest

Recorded: 2015-01-05 Pages: 5
Assignors
MITANI, MUNEHISA
Executed: 2014-11-11
EBE, YUKI
Executed: 2014-11-11
OOYABU, YASUNARI
Executed: 2014-11-17
Assignee
NITTO DENKO CORPORATION
1-2, SHIMO-HOZUMI 1-CHOME, IBARAKI-SHI, OSAKA, 567-8680, JAPAN
Covered Property (1)
Producing Method of Encapsulating Layer-Covered Semiconductor Element and Producing Method of Semiconductor Device
Patent: 9,214,362 →
Application: 14/412,746 →
Publication: US 2015/0194324
Related Assignments (2)
Other recorded transfers of the patent in this record — the chain of ownership.
Assignment of Assignor's Interest Dec 1, 2017
From: NITTO DENKO CORPORATION
To: EPISTAR CORPORATION
Reel/Frame 044278/0175 →
Change of Name Feb 18, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075171/0402 →