Patent Assignment
Reel/Frame 034646/0654
Assignment of Assignor's Interest
Recorded: 2015-01-06
Pages: 3
Assignee
STMICROELECTRONICS PTE LTD
28 ANG MO KIO INDUSTRIAL PARK 2, SINGAPORE, 569508, SINGAPORE
Covered Property
(1)
Chip Scale Package Camera Module with Glass Interposer Having Lateral Conductive Traces Between a First and Second Glass Layer and Method for Making the Same
Related Assignments
(1)
Other recorded transfers of the patent in this record — the chain of ownership.