Patent Assignment
Reel/Frame 068433/0970
Assignment of Assignor's Interest
Recorded: 2024-07-18
Pages: 10
Assignor
STMICROELECTRONICS PTE LTD
Executed: 2024-06-28
Assignee
STMICROELECTRONICS INTERNATIONAL N.V.
CHEMIN DU CHAMP-DES-FILLES 39, PLAN-LES-OUATES, GENEVA, 1228, SWITZERLAND
Covered Properties
(59)
Image Sensor Device with Flexible Interconnect Layer and Related Methods
Electronic Device with Redistribution Layer and Stiffeners and Related Methods
Electronic Device with Redistribution Layer and Stiffeners and Related Methods
Integrated Smo Gas Sensor Module
Integrated Smo Gas Sensor Module
Flexible Smart Glove
Method of Making an Electronic Device Including Two-Step Encapsulation and Related Devices
Image Sensing Device with Interconnect Layer Gap
Integrated Circuit (Ic) Package with Thick Die Pad Functioning as a Heat Sink
Integrated Circuit (Ic) Package with a Solder Receiving Area and Associated Methods
Integrated Circuit (IC) Package with a Solder Receiving Area and Associated Methods
Integrated Circuit (IC) Package with a Solder Receiving Area and Associated Methods
Integrated Circuit Device with Shaped Leads and Method of Forming the Device
Image Sensor Device with Sensing Surface Cavity and Related Methods
Chip Scale Package Camera Module with Glass Interposer Having Lateral Conductive Traces Between a First and Second Glass Layer and Method for Making the Same
Image Sensing Device with Cap and Related Methods
Image Sensing Device with Cap and Related Methods
Image Sensing Device with Cap and Related Methods
Molded Proximity Sensor
Molded Proximity Sensor
Molded Proximity Sensor
Semiconductor Device, Semiconductor Package, and Method for Manufacturing Semiconductor Device
Semiconductor Device, Semiconductor Package, and Method for Manufacturing Semiconductor Device
Wafer Level Packaging for Proximity Sensor
Semiconductor Packages with Pillar and Bump Structures
Proximity Sensor, Electronic Apparatus and Method for Manufacturing Proximity Sensor
Proximity Sensor and Manufacturing Method Therefor
Image Sensor Device with an Electromagnetic Compatibility Shield (Emc) and Associated Methods
Proximity Sensor, Electronic Apparatus and Method for Manufacturing Proximity Sensor
Overmold Proximity Sensor and Associated Methods
Wafer Level Proximity Sensor
Wafer Level Proximity Sensor
Wafer Level Chip Scale Package (Wlcsp) Having Edge Protection
Patent:
9,576,912 →
Application:
14/957,865 →
Optical Sensor Package Including a Cavity Formed in an Image Sensor Die
Optical Sensor Package Including a Cavity Formed in an Image Sensor Die
Optical Sensor Package Including a Cavity Formed in an Image Sensor Die
Semiconductor Sensor Package
Semiconductor Sensor Package
Semiconductor Sensor Package
Integrated Air Quality Sensor That Detects Multiple Gas Species
Gas Analyzer That Detects Gases, Humidity, and Temperature
Gas Sensors
Gas Sensors
Air Venting on Proximity Sensor
Patent:
9,793,427 →
Application:
15/218,966 →
Battery Swap System for Mobile Stations
Proximity Sensor with Integrated Als
Proximity Sensor with Integrated Als
Proximity Sensor with Integrated Als
Ambient Light Sensor with Light Protection
Method for Removing a Sacrificial Layer on Semiconductor Wafers
Crack Detection Integrity Check
Crack Detection Integrity Check
Air-Gap in Trench Field Plate Power Mosfet for Reduced Power Loss Performance
Application:
18/590,785 →
Publication:
US 2025/0275221
Method for Positioning Semiconductor Devices and Corresponding Positioning Apparatus
Application:
18/616,929 →
Publication:
US 2024/0329125
Title Not Available
Application:
63/617,901 →
Optical Sensor Packaging and Method of Manufacture
Application:
63/612,125 →
Semiconductor Packaging with Embedded Emf Shielding Protection Using Wire Bonding
Application:
18/680,178 →
Publication:
US 2024/0421055
Multi-Axis Laser Drilling for Wafer-Level Packaging
Application:
18/733,373 →
Publication:
US 2024/0429095
Gate Contact Structure for a Trench Power Mosfet with a Split Gate Configuration
Application:
18/623,604 →
Publication:
US 2024/0405098
Related Assignments
(13)
Other recorded transfers of the patents in this record — the chain of ownership.
Assignment of Assignor's Interest
Jul 18, 2014
From: SHANKAR, RAVI; LE NEEL, OLIVIER; LOH, TIEN-CHOY; KAM, SHIAN-YEU
To: STMICROELECTRONICS PTE LTD
Reel/Frame 033342/0080 →
Assignment of Assignor's Interest
Dec 22, 2014
From: MA, YIYI; GOH, KIM-YONG; ZHANG, XUEREN; GOH, WEI ZHEN
To: STMICROELECTRONICS PTE LTD
Reel/Frame 034568/0587 →
Assignment of Assignor's Interest
Jan 6, 2015
From: GREBET, JEAN-MICHEL; LIM, WEE CHIN JUDY
To: STMICROELECTRONICS PTE LTD
Reel/Frame 034646/0654 →
Assignment of Assignor's Interest
Jan 13, 2015
From: SHANKAR, RAVI; LENEEL, OLIVIER
To: STMICROELECTRONICS PTE LTD
Reel/Frame 034694/0420 →
Assignment of Assignor's Interest
Feb 13, 2015
From: WONG, WING SHENQ
To: STMICROELECTRONICS PTE LTD
Reel/Frame 034957/0964 →
Assignment of Assignor's Interest
Feb 13, 2015
From: WONG, WING SHENQ
To: STMICROELECTRONICS PTE LTD
Reel/Frame 034958/0413 →
Assignment of Assignor's Interest
Feb 17, 2015
From: GOH, KIM-YONG; MA, YIYI; ZHANG, XUEREN
To: STMICROELECTRONICS PTE LTD
Reel/Frame 034975/0040 →
Assignment of Assignor's Interest
Apr 2, 2015
From: GREBET, JEAN-MICHEL; LIM, WEE CHIN JUDY
To: STMICROELECTRONICS PTE LTD
Reel/Frame 035318/0321 →
Assignment of Assignor's Interest
Jul 7, 2015
From: LUAN, JING-EN
To: STMICROELECTRONICS PTE LTD
Reel/Frame 036010/0355 →
Assignment of Assignor's Interest
Jul 7, 2015
From: LUAN, JING-EN
To: STMICROELECTRONICS PTE LTD
Reel/Frame 036010/0451 →
Assignment of Assignor's Interest
Jul 7, 2015
From: LUAN, JING-EN
To: STMICROELECTRONICS PTE LTD
Reel/Frame 036010/0561 →
Assignment of Assignor's Interest
Aug 19, 2015
From: WONG, WING SHENQ
To: STMICROELECTRONICS PTE LTD
Reel/Frame 036357/0433 →
Assignment of Assignor's Interest
Sep 1, 2016
From: LUAN, JING-EN
To: STMICROELECTRONICS PTE LTD
Reel/Frame 039618/0150 →