Proximity sensor, electronic apparatus and method for manufacturing proximity sensor
The embodiments of the present disclosure provide a proximity sensor, an electronic apparatus and a method for manufacturing a proximity sensor. The proximity sensor comprises a sensor chip, a light-emitting device, a transparent molding material and a non-transparent molding material, wherein the sensor chip comprises a sensor region; the light-emitting device is located on the sensor chip and is electrically coupled to the sensor chip; the transparent molding material at least covers a light-emitting surface of the light-emitting device; and the non-transparent molding material isolates the transparent molding material from the sensor region.
1. A proximity sensor, comprising:
a sensor chip including a sensor region;
a light-emitting device located on the sensor chip and electrically coupled to the sensor chip, the light-emitting device including a light-emitting surface;
a transparent molding material covering the light-emitting surface of the light-emitting device; and
a non-transparent molding material isolating the transparent molding material from the sensor region of the sensor chip.
2. The proximity sensor as claimed in claim 1 , wherein the light-emitting device is sealed by the transparent molding material.
3. The proximity sensor as claimed in claim 1 , further comprising a conductive attachment material, wherein the light-emitting device is secured to the sensor chip by the conductive attachment material.
4. The proximity sensor as claimed in claim 1 , further comprising a filtering component covering the sensor region of the sensor chip.
5. The proximity sensor as claimed in claim 4 , further comprising a transparent adhesive, wherein the filtering component is coupled to the sensor chip by the transparent adhesive.
6. The proximity sensor as claimed in claim 1 , wherein the non-transparent molding material covers a portion of the sensor chip, wherein the sensor region is not covered by the non-transparent molding material.
7. The proximity sensor as claimed in claim 1 , wherein the non-transparent molding material covers a portion of the transparent molding material, wherein a light emergent path of the light-emitting device is not covered by the non-transparent molding material.
8. The proximity sensor as claimed in claim 1 , wherein the sensor chip comprises through-silicon vias.
9. A proximity sensor, comprising:
a sensor chip including a sensor region;
a light-emitting assembly located on the sensor chip, the light-emitting assembly including:
a substrate,
a light-emitting device located on the substrate and electrically coupled to the substrate, and
a transparent molding material covering a light-emitting surface of the light-emitting device, wherein the substrate is electrically coupled to the sensor chip; and
a non-transparent molding material isolating the light-emitting assembly from the sensor region.
10. The proximity sensory as claimed in claim 9 , wherein the non-transparent molding material is located on a surface of the sensor chip between the sensor region and the light-emitting assembly.
11. The proximity sensory as claimed in claim 9 , further comprising transparent molding material covering the sensor region of the sensor chip.
12. An electronic apparatus, comprising:
a proximity sensor including:
a sensor chip including a sensor region, the sensor region located on a first surface of the sensor chip,
a light-emitting device located on the sensor chip and electrically coupled to the sensor chip,
a transparent molding material covering a portion of the light-emitting device and the sensor region of the sensor chip, and
a non-transparent molding material located on the first surface of the sensor chip between the transparent molding material covering the light-emitting device and the sensor region of the sensor chip; and
a controller coupled to the proximity sensor.
13. The electronic apparatus as claimed in claim 12 , wherein the non-transparent molding material covers the first surface of the sensor chip.
14. The electronic apparatus as claimed in claim 12 , wherein the non-transparent molding material covers side surfaces of the sensor chip.
15. A method for manufacturing a proximity sensor, comprising:
placing a light-emitting device on a first portion of a surface of a sensor chip, a second portion of the surface of the sensor chip including a sensor region;
electrically coupling the light-emitting device to the sensor chip;
covering a light-emitting surface of the light-emitting device with a transparent molding material; and
isolating the transparent molding material from the sensor region by forming a non-transparent molding material on the surface of the sensor chip between the first and second portions.
16. The method as claimed in claim 15 , wherein prior to placing the light-emitting device on the first portion of the sensor chip, the method comprises placing the sensor chip on a carrier;
the method further comprising:
after isolating the transparent molding material from the sensor region, removing the carrier.
17. The method as claimed in claim 15 , wherein covering the light-emitting surface of the light-emitting device with the transparent molding material comprises:
sealing the light-emitting device with the transparent molding material.
18. The method as claimed in claim 15 , wherein electrically coupling the light-emitting device to the sensor chip comprises:
attaching the light-emitting device to the sensor chip using a conductive attachment material.
19. The method as claimed in claim 15 , further comprising:
after covering the light-emitting surface of the light-emitting device with the transparent molding material, and before isolating the transparent molding material from the sensor region by forming the non-transparent molding material, placing a filtering component above the sensor region.
20. The method as claimed in claim 19 , wherein placing the filtering component above the sensor region comprises:
adhering the filtering component to the sensor chip by a transparent adhesive.
21. The method as claimed in claim 15 , wherein isolating the transparent molding material from the sensor region by forming the non-transparent molding material further comprises:
partially covering the first portion of the surface of the sensor chip with the non-transparent molding material, such that the second portion of the surface of the sensor chip is not covered by the non-transparent molding material.
22. The method as claimed in claim 15 , wherein isolating the transparent molding material from the sensor region by forming a non-transparent molding material further comprises:
partially covering the transparent molding material with the non-transparent molding material, wherein a light emergent path of the light-emitting device is not covered by the non-transparent molding material.
23. The method as claimed in claim 15 , wherein the sensor chip comprises through-silicon vias.
24. The method as claimed in claim 15 , further comprising:
after isolating the transparent molding material from the sensor region with the non-transparent molding material, performing singulation processing.
25. A method for manufacturing a proximity sensor, comprising:
coupling a light-emitting assembly to a first portion of a surface of a sensor chip, a second portion of the surface of the sensor chip including a sensor region that remains exposed, the light-emitting assembly including:
a substrate,
a light-emitting device located on the substrate and electrically coupled to the substrate, and
a transparent molding material at least covering a light-emitting surface of the light-emitting device; and
forming a non-transparent molding material on the sensor chip between the first and second portions thereby isolating the light-emitting assembly from the sensor region.
26. The method as claimed in claim 25 , further comprising coupling a transparent molding material to the sensor region of the sensor chip using an adhesive material.